OSAT Market Challenges ChipScale Review, May-June 2019
OSAT Consolidation Continues Semiconductor Engineering, May 14, 2018 (quoted in this article)
Packaging Chips for Cars Semiconductor Engineering, May 7, 2018 (quoted in this article)
Semiconductor Packaging News Viewpoint 2018 Semiconductor Packaging News, Feb 12, 2018
Packaging ICs to Survive the Automotive Environment MEPTEC Symposium, Nov 15, 2015
Smart Grid Technology of the Future ECN, Mar 2013
Sub-metering made easy using Texas Instruments™ energy measurement ICs Whitepaper, Texas Instruments, May 2012
Energy Measurement for Appliances ECN; Jan 2012
Preventing Excess Current Consumption on Analog Switches Application Note, Texas Instruments, Jul 2008
Manage mixed voltages in memory card interfaces, EE Times, Aug 2007
Secrets of Level Translation revealed, EE Times, Oct 2004
Choosing the right level translation solution, Application Note; Texas Instruments, June 2004
Simultaneous Switching Performance of TI Logic Devices, Application Note; Texas Instruments, Sep 2003